Advanced liquid cooling systems are increasingly being integrated into the next-generation architectures of major North American clients, with multiple domestic companies actively providing samples. Additionally, liquid cooling solutions are gaining significant adoption in the humanoid robotics sector, with leading clients in both North America and China increasingly implementing these technologies.
In server applications, advanced liquid cooling systems combine piezoelectric fans with heat pipes and 3D vapor chambers (3DVC) to create highly efficient thermal modules. This integration enhances airflow over heat sink surfaces, significantly improving heat exchange efficiency and making it well-suited for high-density server chassis. The synergy between piezoelectric fans and liquid cooling maximizes the strengths of both technologies: liquid cooling effectively manages high-power heat dissipation, while piezoelectric fans address localized hotspots. By strategically placing piezoelectric fans near heat sources such as CPUs and GPUs, liquid cooling pipelines transfer heat to the heat sink, where the high-frequency vibrations of piezoelectric fans accelerate airflow. This enhances convective heat transfer, overcoming the limitations of liquid cooling in managing localized hotspots, thereby improving overall server thermal efficiency and reducing energy consumption.
Lens Technology has successfully mass-produced advanced thermal solutions incorporating piezoelectric fans for Taiwanese clients. These solutions provide superior cooling performance, occupy less space, and deliver significantly higher value compared to conventional thermal modules.
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